Qualcomm is working on an ultrasonic subscreen dactyloscopic sensor

According to Digital Chat Station, in the near future Qualcomm will release on the market an improved subscreen fingerprint sensor with a larger sensor and shorter response time.

Many do not know, but Qualcomm company is engaged not only in the production of chips, but also fingerprint sensors. Recent leaks indicate that an ultrasonic sensor is about to appear on the market, the speed of which will be the highest among the company's range, and its working surface will increase to 20x30 mm, making the identification procedure more simple. The transducer may appear together with the new Snapdragon 875 chip.

In addition, the manufacturer is preparing the next generation of 3D Sonic Max sensors, capable of simultaneous scanning of two prints. The sensor can already appear in Galaxy Note 20.